TLDB-085 Semi-Automatic Leak Detection Box: Precision Leak Testing Solution for Semiconductor Manufacturing and Vacuum Technology

The TLDB-085 semi-automatic leak detection box is specially designed for semiconductor manufacturing, vacuum technology, and aerospace industries. Featuring ultra-high sensitivity of 1.0E-12 mbar·L/s, it supports multiple test gases (HE3/HE4/H2) and is the ideal solution for chip package leak testing and precision instrument inspection.

Product Overview for Semiconductor Manufacturing

The TLDB-085 semi-automatic leak detection box is an advanced testing device specifically engineered for the semiconductor manufacturing sector. Available in both pressurized helium and vacuum leak detection configurations, this system is optimized for chip package leak testing while also being suitable for small component helium charging detection. Offering both semi-automatic and manual operation modes, it addresses diverse testing requirements throughout semiconductor production processes.

Technical Highlights for Vacuum Technology Applications

Smart Communication: Integrated advanced interface for seamless connection with mainstream helium mass spectrometers

Multi-standard Port Adapters: Standard KF40/KF25/KF16 vacuum flanges with customization options for aerospace applications

Ultra-high Sensitivity: 1.0E-12 mbar·L/s detection limit meets stringent medical device manufacturing standards

Full Customization Support: Tailored solutions for materials science research requirements

Aerospace-grade Construction: Manufactured from 304 stainless steel for maximum durability

Application Fields in Aerospace and Medical Industries

Semiconductor Manufacturing: Wafer-level packaging, chip hermeticity testing

Vacuum Technology: Vacuum chamber, valve system integrity verification

Aerospace Industry: Spacecraft sealing components, fuel system leak detection

Medical Device Manufacturing: Implantable medical equipment, precision instrument sealing tests

Materials Science Research: Gas permeability evaluation of novel composite materials

Technical Specifications for Semiconductor Applications

FAQ for Vacuum Technology & Leak Detection Systems

1. Primary applications in semiconductor manufacturing?
Specialized for hermeticity testing in chip packaging processes, capable of detecting micron-level leaks.

2. Compliance with vacuum technology standards?
Fully complies with ISO vacuum technology standards, certified to 1.0E-12 mbar·L/s.

3. Why preferred by aerospace industry?
Military-grade 304 stainless steel construction and customizable ports ideal for spacecraft component testing.

4. Advantages for medical device manufacturing?
Nanoscale leak detection capability for implantable medical devices.

5. Value in materials science research?
Provides precise gas permeability data for new composite materials.

6. How is helium mass spec sensitivity ensured?
Multiple gas detection (HE3/HE4/H2) protocol guarantees result accuracy.

7. Standard chip package leak test procedure?
Four-step process: vacuum → helium charge → detection → data analysis.

8. Why 304 stainless steel for vacuum boxes?
Corrosion-resistant, non-magnetic, high stability suitable for cleanroom environments.

9. Key considerations for precision instrument testing?
Requires regular calibration, clean connections, and vibration isolation.

10. Maintenance recommendations for leak detection systems?
Monthly integrity checks, quarterly seal replacement, annual professional calibration.